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High density interconnect for high speed storage

Astute Electronics Ltd : 30 January, 2015  (New Product)
The AirBorn high density HD4 interconnect technology available from Astute Electronics provides highly reliable connectivity for demanding data centre and cloud computing applications
High density interconnect for high speed storage

Astute Electronics is introducing AirBorn’s high-density, high-reliability HD4 interconnect technology, which was designed to be an electrically-optimized and highly dense physical layer medium for the HyperTransport Technology Consortium’s industry-standard HyperShare scalable interconnect technology. Claimed to be the smallest footprint in the industry, HD4’s high bandwidth, minimized signal loss and mission-critical reliability suit it for demanding, multi-dimensional network fabrics and ultra-fast storage/SSD cluster applications used in next-generation data centre and cloud computing platforms.

Although developed for the HyperShare platform, HD4 products also suit many other popular high-performance interconnect standards. The I/O link targets rack-in-cabinet-based systems that require higher bandwidth and density, providing up to six I/O ports on a 7.4 mm pitch along a low-profile PCIe. The eight differential pair (100 and 85Ω) twinax cable construction enables 4-channels with 2.5 to 10 Gb/s data rates per channel.

The 1A contacts feature four points of contact for superior performance and reliability, and devices can be mated and demated up to 2500 times. An open-pin field design allows for flexibility in termination schemes (single-ended, differential pair, power and ground or both), and robust die-cast shells provide EMI shielding and simple termination.

Comments Gary Evans who heads up Astute’s newly-formed Franchise Connectors Division: “Airborn is renowned for its high quality, innovative interconnect solutions. The HD4 connectors enable very high density – more than competing solution – and are designed to be used in busy, unforgiving environments.”

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