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News

TTI - DensiPac Connector Family


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TTI (Europe)
: 17 May, 2007  (New Product)
The DensiPac connector family is the first backplane connector system which can be installed fully automatically in surface mount (SMT) systems. Using SMT connectors at the module-to-backplane interface provides up to 30% lower component assembly costs. Surface mounting combined with using DensiPac connectors allows up to 576 pins per 100 mm of card edge, using four row modules on both sides of the card. The male (backplane) connector is available in two variations: SMT (25 mm long) and press-fit. The SMT connector can be automatically assembled along with all other SMT components and then reflow soldered.
The female connector design involves anchor strips that are pressed into the housings and will accept share-forces of up to 200 N. Centering pins and a centering plate above the connection legs ensures coplanarity below 0.1 mm and guarantees that the contacts are centered on the solder pads. Also, two row female connectors can be plugged into four row male connectors, making subsequent upgrading very simple.

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